JPH0412679Y2 - - Google Patents

Info

Publication number
JPH0412679Y2
JPH0412679Y2 JP1987082402U JP8240287U JPH0412679Y2 JP H0412679 Y2 JPH0412679 Y2 JP H0412679Y2 JP 1987082402 U JP1987082402 U JP 1987082402U JP 8240287 U JP8240287 U JP 8240287U JP H0412679 Y2 JPH0412679 Y2 JP H0412679Y2
Authority
JP
Japan
Prior art keywords
heat sink
resin
lead wire
semiconductor chip
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1987082402U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63191644U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987082402U priority Critical patent/JPH0412679Y2/ja
Publication of JPS63191644U publication Critical patent/JPS63191644U/ja
Application granted granted Critical
Publication of JPH0412679Y2 publication Critical patent/JPH0412679Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1987082402U 1987-05-29 1987-05-29 Expired JPH0412679Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987082402U JPH0412679Y2 (en]) 1987-05-29 1987-05-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987082402U JPH0412679Y2 (en]) 1987-05-29 1987-05-29

Publications (2)

Publication Number Publication Date
JPS63191644U JPS63191644U (en]) 1988-12-09
JPH0412679Y2 true JPH0412679Y2 (en]) 1992-03-26

Family

ID=30935026

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987082402U Expired JPH0412679Y2 (en]) 1987-05-29 1987-05-29

Country Status (1)

Country Link
JP (1) JPH0412679Y2 (en])

Also Published As

Publication number Publication date
JPS63191644U (en]) 1988-12-09

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